Viscosity / Flowability: 100 (Pa.s) 22°C, Specific Gravity: 3.0 (25°C), Weight: 3 g.
XO NB-R258C Adapter Lightning + 3.5mm konektor
1 × 11,00 KM
XO USB Micro USB to Lightining adapter NB130 new
1 × 3,00 KM
HDMI to VGA +Audio Adapter
1 × 15,00 KM
Adapter 3.5mm - 2.5mm F/M - AC-018
1 × 3,00 KM
CPU cooler Arctic Alpine 17 ACALP00040A, LGA1700
1 × 29,00 KM
ROUTER Mercusys MW306R 300 Mbps Multi-Mode Wireless N Router, 3 × Fixed External Antennas, 3× 10/100 LAN Port, 1× 10/100 WAN Port, 4 in 1- Access Poin
1 × 32,00 KM
Zvučnici 2.0 ESPERANZA LEGGIERO Cube, EP111
1 × 10,70 KM
MERCUSYS AC12G AC1300 Dual Band Wireless Router 867Mbps 5GHz 300Mbps 2.4GHz 10/100/1000M WAN 10/100/1000M LAN 4fixed ant
1 × 66,00 KM
Zvučnici 2.0 ESPERANZA USB, 2.0 LED RAINBOW BAILA, EGS103
1 × 45,00 KM
Zvučnici 2.0 ESPERANZA USB SPEAKERS 2.0 LED RAINBOW FREVO EGS105
1 × 22,00 KM
Pasta za CPU hladnjak GEMBIRD TG-G1.5-01
1 × 7,00 KM
SWITCH 5 portni 10/100 D-LINK, DES-1005P/E,POE
1 × 119,00 KM
SATA Kabl Data 0.4m
1 × 3,00 KM
CPU hladnjak RAMPAGE OCTAGON C70 Black 63CFM 12cm ARGB Temperature Display AM5/LGA1700 Compatible Air Cooled CPU Fan, 41402
1 × 79,00 KM
Mobitel Honor X7a 4GB 128GB blue
1 × 349,00 KM
Pasta za CPU hladnjak GEMBIRD TG-G3.0-01
1 × 9,00 KM Ukupno: 802,70 KM
Viscosity / Flowability: 100 (Pa.s) 22°C, Specific Gravity: 3.0 (25°C), Weight: 3 g.

CPU hladnjak RAMPAGE OCTAGON C60 White 57CFM 1800RPM 2x12cm ARGB AM5/LGA1700 Compatible Air Cooled CPU Fan

CPU hladnjak RAMPAGE OCTAGON C60 Black 57CFM 1800RPM 2x12cm ARGB AM5/LGA1700 Compatible Air Cooled CPU Fan
Thermal compund (grease) for heatsinks, Helps the heat dissipation from a CPU, chipset or processor to a heatsink, Excellent thermal impedance, Perfect stability – will not separate, run, migrate, or bleed, Non capacitive or electrically conductive, Specifications, Weight: 1.5 g, Color: grey, Thermal conductivity: > 4.5 W / mK, Thermal Impedance 2.5, Evaporation: <0.001 %, Volatility: 5.1, Dissipation Factor: <0.005, Viscosity: 76 CPS, Thixotropic index: 310 ± 10 C, Operating Temperature: -50 240 C, Composites: 50% silicone compounds, Compounds: 30% of carbon, The compounds of metal oxides: 20%
Thermal compund (grease) for heatsinks, Helps the heat dissipation from a CPU, chipset or processor to a heatsink, Excellent thermal impedance, Perfect stability – will not separate, run, migrate, or bleed, Non capacitive or electrically conductive


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