Pasta za CPU hladnjak GEMBIRD TG-G1.5-01
Dostupno
Thermal compund (grease) for heatsinks, Helps the heat dissipation from a CPU, chipset or processor to a heatsink, Excellent thermal impedance, Perfect stability – will not separate, run, migrate, or bleed, Non capacitive or electrically conductive, Specifications, Weight: 1.5 g, Color: grey, Thermal conductivity: > 4.5 W / mK, Thermal Impedance <0.205 C-in2 / W, Density: > 2.5, Evaporation: <0.001 %, Volatility: <0.005 %, The dielectric constant: > 5.1, Dissipation Factor: <0.005, Viscosity: 76 CPS, Thixotropic index: 310 ± 10 C, Operating Temperature: -50 240 C, Composites: 50% silicone compounds, Compounds: 30% of carbon, The compounds of metal oxides: 20%
7,00 KM
Dostupno
Thermal compund (grease) for heatsinks, Helps the heat dissipation from a CPU, chipset or processor to a heatsink, Excellent thermal impedance, Perfect stability – will not separate, run, migrate, or bleed, Non capacitive or electrically conductive, Specifications, Weight: 1.5 g, Color: grey, Thermal conductivity: > 4.5 W / mK, Thermal Impedance <0.205 C-in2 / W, Density: > 2.5, Evaporation: <0.001 %, Volatility: <0.005 %, The dielectric constant: > 5.1, Dissipation Factor: <0.005, Viscosity: 76 CPS, Thixotropic index: 310 ± 10 C, Operating Temperature: -50 240 C, Composites: 50% silicone compounds, Compounds: 30% of carbon, The compounds of metal oxides: 20%
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