Spire Termalna pasta SP-456 1g

Thermal compund (grease) for heatsinks, Helps the heat dissipation from a CPU, chipset or processor to a heatsink, Excellent thermal impedance, Perfect stability – will not separate, run, migrate, or bleed, Non capacitive or electrically conductive, Specifications, Weight: 1.5 g, Color: grey, Thermal conductivity: > 4.5 W / mK, Thermal Impedance 2.5, Evaporation: <0.001 %, Volatility: 5.1, Dissipation Factor: <0.005, Viscosity: 76 CPS, Thixotropic index: 310 ± 10 C, Operating Temperature: -50 240 C, Composites: 50% silicone compounds, Compounds: 30% of carbon, The compounds of metal oxides: 20%